Taiwan Semiconductor Manufacturing Co., Ltd Patent Portfolio Statistics

Publication number: US20210111272A1

Abstract:
A method includes forming a fin on a substrate, forming an insulating material over the fin, recessing the insulating material to form an isolation region surrounding the fin, wherein an upper portion of the fin protrudes above the isolation region, performing a trimming process to reduce a width of the upper portion of the fin, and forming a gate structure extending over the isolation region and the upper portion of the fin.

Publication date: 2021-04-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
Inventors: Chung-Shu Wu

---

Publication number: US20210109059A1

Abstract:
An on-chip heater in a concentric rings configuration having non-uniform spacing between heating elements provides improved radial temperature uniformity and low power consumption compared to circular or square heating elements. On-chip heaters are suitable for integration and use with on-chip sensors that require tight temperature control.

Publication date: 2021-04-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
Inventors: Cheng-Hsiang Hsieh

---

Publication number: US20190058500A1

Abstract:
Circuits and methods for performing a clock and data recovery are disclosed. In one example, a clock and data recovery circuit is disclosed. The circuit includes a third order digital filter, e.g. a finite state machine (FSM) that includes three accumulators connected in series. Among the three accumulators, a first accumulator receives an input phase code representing a phase timing difference between a data signal and a clock signal at each FSM cycle and accumulates input phase codes for different FSM cycles to generate a first order phase code at each FSM cycle; a second accumulator accumulates the input phase codes and first order phase codes for different FSM cycles to generate a second order phase code at each FSM cycle; and a third accumulator accumulates the input phase codes and second order phase codes for different FSM cycles to generate a third order phase code at each FSM cycle.

Publication date: 2019-02-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
Inventors: Lan Po-Hsiang

---