Raytheon Company Patent Portfolio Statistics

Publication number: US20220003509A1

Abstract:
A method of forming a thermal energy storage unit for a surface to be cooled or heated includes using an additive manufacturing process to form a plurality of non-rectilinear structures having a plurality of thermally conductive substructures, the substructures defining a plurality of interior cavities within the substructures and a plurality of exterior fluid channels that cross over or under the plurality of interior cavities, arranging the plurality of non-rectilinear structures in a plurality of housings, wherein each of the plurality of non-rectilinear structures is arranged in a corresponding one of the plurality of housings, and connecting the plurality of housings to each other to build up the thermal energy storage unit whereby the thermal energy storage unit is modular.

Publication date: 2022-01-06
Applicant: Raytheon Company
Inventors: I Maniscalco Nicholas

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Publication number: US20210400820A1

Abstract:
A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.

Publication date: 2021-12-23
Applicant: Raytheon Company
Inventors: Beninati G Gregory

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Publication number: US20210368629A1

Abstract:
An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

Publication date: 2021-11-25
Applicant: Raytheon Company
Inventors: Mikhail Pevzner

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