Tokyo Electron Limited Patent Portfolio Statistics

Tokyo Electron Limited

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Tokyo Electron Limited look like?

Assignee Art Units
Total Applications: 10,833 2,261,343
Granted Patents: 6,981 1,479,343
Grant Index 76.82% 79.17%
Abandoned/Rejected Applications: 2,106 (23.18%) 389,336 (20.83%)
In-Process Applications: 1,672 392,664
Average Grant Time: 2.84 Years 2.54 Years
Average Office Actions: 1.61 1.46

Which Technology Area Tokyo Electron Limited is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
1716 Coating, Etching, Cleaning, Single Crystal Growth 1,300
1713 Coating, Etching, Cleaning, Single Crystal Growth 799
Opap Parked GAU 572
1792 475
1718 Coating, Etching, Cleaning, Single Crystal Growth 345

How many patents are Tokyo Electron Limited filing every year?

Year Total Applications Predicted
2022 1* 960
2021 577* 839
2020 739 825
2019 644 644
2018 522
2017 486
2016 395
2015 491
2014 569
2013 372

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Tokyo Electron Limited in USPTO?

Publication number: None
Application number: 17/702,883

Abstract:


Publication date:
Applicant: Tokyo Electron Limited
Inventors: Koji Maekawa


Publication number: US20220178014A1
Application number: 17/631,188

Abstract:
A film forming apparatus includes a processing container, a substrate holder configured to hold a substrate inside the processing container, a cathode unit disposed above the substrate holder, and a gas introducing mechanism configured to introduce a plasma generating gas into the processing container. The cathode unit includes a target, a power supply configured to supply electric power to the target, a magnet provided on a rear side of the target, and a magnet driving part configured to drive the magnet. The magnet driving part includes an oscillation driver configured to oscillate the magnet along the target, and a perpendicular driver configured to drive the magnet in a direction perpendicular to a main surface of the target independently of driving performed by the oscillation driver. Sputtered particles are deposited on the substrate by magnetron sputtering.

Publication date: 2022-06-09
Applicant: Tokyo Electron Limited
Inventors: Koji Maeda


Publication number: US20220165538A1
Application number: 17/299,721

Abstract:
A plasma processing apparatus according to an exemplary embodiment includes a processing container, a stage, an upper electrode, a shower plate, and a waveguide, wherein the stage is provided inside the processing container, the shower plate is provided above the stage with a space in the processing container interposed between the shower plate and the stage, the upper electrode is provided above the shower plate, the waveguide includes an end portion and guides radio-frequency waves in a VHF band or a UHF band therethrough, the end portion is disposed to face the space, and emits the radio-frequency waves to the space, the shower plate includes a plurality of pillars and is made of a dielectric material, gaps are provided inside the shower plate, and the plurality of pillars are disposed in the gaps, respectively.

Publication date: 2022-05-26
Applicant: Tokyo Electron Limited
Inventors: Hirayama Masaki


How are Tokyo Electron Limited’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/702,883 Tungsten Film Forming Method, Semiconductor Device Manufacturing Method, And Storage Medium Docketed New Case – Ready for Examination 3991 Witz, Jean C
17/631,188 Film Forming Apparatus And Film Forming Method Docketed New Case – Ready for Examination OPAP Central, Docket
17/299,721 Plasma Processing Apparatus And Plasma Processing Method Docketed New Case – Ready for Examination OPAP Central, Docket
17/644,378 Substrate Processing Apparatus And Substrate Processing Method Docketed New Case – Ready for Examination OPAP Central, Docket
17/548,594 Plasma Processing Apparatus OPAP Central, Docket