Texas Instruments Incorporated Patent Portfolio Statistics

Publication number: US20220091919A1
Application number: 17/543,827

Abstract:
A circuit includes a dynamic core data register (DCDR) cell that includes a data register, a shift register and an output circuit to route the output state of the data register or the shift register to an output of the DCDR in response to an output control input. A clock gate having a gate control input controls clocking of the shift register in response to a first scan enable signal. An output control gate controls the output control input of the output circuit and controls which outputs from the data register or the shift register are transferred to the output of the output circuit in response to a second scan enable signal. The first scan enable signal and the second scan enable signal to enable a state transition of the shift register at the output of the DCDR.

Publication date: 2022-03-24
Applicant: Texas Instruments Incorporated
Inventors: Pradeep Wilson

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Publication number: US20220094921A1
Application number: 17/543,767

Abstract:
A method for in-loop filtering in a video encoder is provided that includes determining filter parameters for each filtering region of a plurality of filtering regions of a reconstructed picture, applying in-loop filtering to each filtering region according to the filter parameters determined for the filtering region, and signaling the filter parameters for each filtering region in an encoded video bit stream, wherein the filter parameters for each filtering region are signaled after encoded data of a final largest coding unit (LCU) in the filtering region, wherein the in-loop filtering is selected from a group consisting of adaptive loop filtering and sample adaptive offset filtering.

Publication date: 2022-03-24
Applicant: Texas Instruments Incorporated
Inventors: Sze Vivienne

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Publication number: US20220092767A1
Application number: 17/544,896

Abstract:
An IC assembly including an exposed pad integrated circuit (“IC”) package having a thermal pad with a top surface and a bottom surface and with at least one peripheral surface portion extending transversely of and continuous with the bottom surface. The bottom surface and the at least one peripheral surface are exposed through a layer of mold compound. Also, methods of making an exposed pad integrated circuit (“IC”) package assembly. One method includes optically inspecting a solder bond bonding a thermal pad of an exposed pad IC package to a printed circuit board. Another method includes wave soldering an exposed pad of an IC package to a printed circuit board.

Publication date: 2022-03-24
Applicant: Texas Instruments Incorporated
Inventors: Alok Kumar Lohia

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