Taiyo Yuden Co., Ltd Patent Portfolio Statistics

Taiyo Yuden Co., Ltd.

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Taiyo Yuden Co., Ltd. look like?

Total Applications: 1,754
Granted Patents: 1,312
Grant Index 87.7 %
Abandoned/Rejected Applications: 184 (12.3%)
In-Process Applications: 250
Average Grant Time: 2.4 Years
Average Office Actions: 1.37

Which Technology Area Taiyo Yuden Co., Ltd. is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
2848 Electrical Circuits and Systems 255
2837 Electrical Circuits and Systems 209
2842 Electrical Circuits and Systems 136
2817 Semiconductors/Memory 132
Opap Parked GAU 124

How many patents are Taiyo Yuden Co., Ltd. filing every year?

Year Total Applications
2022 0*
2021 81*
2020 123
2019 148
2018 144

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Taiyo Yuden Co., Ltd. in USPTO?

Publication number: US20220028619A1
Application number: 17/498,558

Abstract:
A multi-layer ceramic electronic component includes a ceramic body and an external electrode, the ceramic body including a protective portion and a functional portion, the protective portion including an end surface facing in a first direction, circumferential surfaces connected to the end surface and extending in the first direction, and a ridge that includes a recess extending along the first direction and connects the circumferential surfaces, the functional portion being disposed inside the protective portion, the external electrode including a base film covering the end surface, an intermediate film formed on the base film, and a surface film formed on the intermediate film, the base film including a first covering portion formed on the end surface, second covering portions formed on the circumferential surfaces, and a third covering portion formed on the recess and spaced apart from at least one second covering portion, the intermediate film continuously covering the first, second, and third covering portions.

Publication date: 2022-01-27
Applicant: Taiyo Yuden Co., Ltd.
Inventors: Fukuoka Tetsuhiko


Publication number: US20210400816A1
Application number: 17/464,450

Abstract:
In an exemplary embodiment, a passive component, which is a surface mounting component, includes: a substrate body having insulating property; an internal conductor built into the substrate body; and at least one external electrode provided on a planar mounting face of the substrate body and electrically connected to the internal conductor; wherein the external electrode has a face parallel with the planar mounting face of the substrate body, and a concaved part which is inwardly concaved relative to the parallel face toward the substrate body and is located, as viewed in a direction perpendicular to the parallel face, inside the parallel surface so as to be surrounded by the parallel surface.

Publication date: 2021-12-23
Applicant: Taiyo Yuden Co., Ltd.
Inventors: Osamu Takahashi


Publication number: US20210375532A1
Application number: 17/404,622

Abstract:
A coil component, adopted to be mounted on an electronic device, includes: an element body part; a coil fixed to the element body part and constituted by a wound conductive wire; lead wires that are each extended from the conductive wire and led out from the coil, and whose tip parts are each disposed a bottom face, which is a mounting face, of the element body part; and terminal parts that are each constituted by the tip part and a metal member that is joined to the tip part on the bottom face, and also has an opening at a position overlapping the tip part in a direction intersecting the bottom face.

Publication date: 2021-12-02
Applicant: Taiyo Yuden Co., Ltd.
Inventors: Kawamura Keizo


How are Taiyo Yuden Co., Ltd.’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/498,558 Multi-Layer Ceramic Electronic Component And Method Of Producing The Same OPAP Central, Docket
17/464,450 Passive Component And Electronic Device Docketed New Case – Ready for Examination OPAP Central, Docket
17/404,622 Coil Component And Electronic Device Docketed New Case – Ready for Examination OPAP Central, Docket
17/392,006 Coil Component Docketed New Case – Ready for Examination OPAP Central, Docket
17/390,172 Vibration Sensor Docketed New Case – Ready for Examination OPAP Central, Docket