Taiwan Semiconductor Manufacturing Company, Ltd Patent Portfolio Statistics

Taiwan Semiconductor Manufacturing Company, Ltd.

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Taiwan Semiconductor Manufacturing Company, Ltd. look like?

Assignee Art Units
Total Applications: 10,701 2,270,178
Granted Patents: 9,127 1,524,842
Grant Index 94.62% 80.94%
Abandoned/Rejected Applications: 519 (5.38%) 358,977 (19.06%)
In-Process Applications: 1,023 386,359
Average Grant Time: 2.57 Years 2.44 Years
Average Office Actions: 1.84 1.39

Which Technology Area Taiwan Semiconductor Manufacturing Company, Ltd. is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
2818 Semiconductors/Memory 471
Opap Parked GAU 451
2851 Printing/Measuring and Testing 420
2822 Semiconductors/Memory 382
2813 Semiconductors/Memory 367

How many patents are Taiwan Semiconductor Manufacturing Company, Ltd. filing every year?

Year Total Applications Predicted
2022 0* 939
2021 520* 875
2020 587 772
2019 637 637
2018 511
2017 467
2016 453
2015 725
2014 843
2013 1,092

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Taiwan Semiconductor Manufacturing Company, Ltd. in USPTO?

Publication number: None
Application number: 63/310,478

Abstract:


Publication date:
Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
Inventors: Chia Chun Wu


Publication number: US20220108984A1
Application number: 17/554,811

Abstract:
A semiconductor device according to an embodiment includes a first gate-all-around (GAA) transistor and a second GAA transistor. The first GAA transistor includes a first plurality of channel members, a first interfacial layer over the first plurality of channel members, a first hafnium-containing dielectric layer over the first interfacial layer, and a metal gate electrode layer over the first hafnium-containing dielectric layer. The second GAA transistor includes a second plurality of channel members, a second interfacial layer over the second plurality of channel members, a second hafnium-containing dielectric layer over the second interfacial layer, and the metal gate electrode layer over the second hafnium-containing dielectric layer. A first thickness of the first interfacial layer is greater than a second thickness of the second interfacial layer. A third thickness of the first hafnium-containing dielectric layer is smaller than a fourth thickness of the second hafnium-containing dielectric layer.

Publication date: 2022-04-07
Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
Inventors: Jia-Ni Yu


Publication number: US20220107694A1
Application number: 17/554,503

Abstract:
Converter and conversion method for converting a click position of a flat panel display into a light pen simulated signal for a semiconductor manufacturing machine are provided. A converter includes a first connector, a second connector, and a controller coupled between the first connector and the second connector. The first connector is configured to obtain the click position from the flat panel display. The second connector is configured to provide the light pen simulated signal to the semiconductor manufacturing machine according to a synchronization signal from the semiconductor manufacturing machine. The controller is configured to generate the light pen simulated signal according to the click position and a mapping table of a first display resolution of the flat panel display and a second display resolution of the semiconductor manufacturing machine. The first display resolution is higher than the second display resolution.

Publication date: 2022-04-07
Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
Inventors: Chen Ming-Sze


How are Taiwan Semiconductor Manufacturing Company, Ltd.’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
63/310,478 Layout And Structure Floorplan Technique For Aoi/Oai Application Dispatched from Preexam, Not Yet Docketed
17/554,811 Input/Output Semiconductor Devices Docketed New Case – Ready for Examination OPAP Central, Docket
17/554,503 Converter And Conversion Method For Converting Click Position Of Display Into Light Pen Simulated Signal For Semiconductor Manufacturing Machine Docketed New Case – Ready for Examination OPAP Central, Docket
17/554,475 Chip Package Structure Docketed New Case – Ready for Examination OPAP Central, Docket
17/554,552 Formation Method Of Chip Package With Fan-Out Feature Docketed New Case – Ready for Examination OPAP Central, Docket