Semiconductor Components Industries, Llc Patent Portfolio Statistics

Semiconductor Components Industries, Llc

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Semiconductor Components Industries, Llc look like?

Assignee Art Units
Total Applications: 6,419 2,163,169
Granted Patents: 5,680 1,482,927
Grant Index 94.27% 83.07%
Abandoned/Rejected Applications: 345 (5.73%) 302,231 (16.93%)
In-Process Applications: 375 378,011
Average Grant Time: 2.49 Years 2.47 Years
Average Office Actions: 1.51 1.37

Which Technology Area Semiconductor Components Industries, Llc is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
2838 Electrical Circuits and Systems 791
2816 Semiconductors/Memory 243
2818 Semiconductors/Memory 216
2826 Semiconductors/Memory 192
2819 Semiconductors/Memory 177

How many patents are Semiconductor Components Industries, Llc filing every year?

Year Total Applications Predicted
2022 0* 925
2021 93* 807
2020 346 855
2019 400 400
2018 397
2017 309
2016 356
2015 211
2014 248
2013 234

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Semiconductor Components Industries, Llc in USPTO?

Publication number: US20220191398A1
Application number: 17/643,207

Various embodiments provide an optical image stabilization system, comprising: a sensor configured to detect a disturbance signal; a processor; an actuator; and an actuator driver. The sensor can be configured to detect a disturbance signal, wherein the disturbance signal applies a force to a moving body, and wherein the force causes the moving body to displace. The processor can be configured to determine: a target position of the moving body according to the detected disturbance signal; and a corrected driving current according to the target position. The actuator can be configured to: receive the corrected driving current receive the corrected driving current; and position the moving body in response to receiving the corrected driving current, wherein the moving body is positioned in a direction opposite to that of the displacement. The actuator driver can be configured to controllably operate the actuator according to the corrected driving current.

Publication date: 2022-06-16
Applicant: Semiconductor Components Industries, Llc
Inventors: Tabuchi Yoshihisa

Publication number: US20220094286A1
Application number: 17/457,702

Implementations of a system for sensing rotor position of a PMSM may include: a controller which may be coupled with the PMSM. The controller may be configured to apply a plurality of voltage vectors to the PMSM to generate a plurality of sensing signals from a stator of the PMSM in response. A comparator may be coupled to the PMSM configured to receive and to compare each one of the plurality of sensing signals with a threshold voltage. A rise time measurement circuit may calculate a plurality of rise times using the plurality of sensing signals in response to receiving a signal from the comparator. The rotor-angle estimation circuit may be configured to identify from the plurality of rise times a shortest rise time and a voltage vector corresponding with the shortest rise time and thereby identify the position of the rotor of the PMSM.

Publication date: 2022-03-24
Applicant: Semiconductor Components Industries, Llc
Inventors: Masanori Okubayashi

Publication number: US20220084920A1
Application number: 17/457,148

Methods of forming semiconductor packages include providing a lead frame having leads and no tie-bars. Tape is attached to the lead frame and one or more semiconductor die are coupled therewith. Electrical contacts of the die are interconnected with the leads using electrical connectors. An encapsulated assembly is formed by at least partially encapsulating the die and electrical connectors. The assembly is singulated to form a semiconductor package. The tape is detached from the package or encapsulated assembly. One or more die attach flags may be attached to the tape and the die may be attached thereto. Semiconductor packages formed using the methods include one or more semiconductor die at least partially encapsulated, pins exposed through the encapsulant, electrical connectors within the encapsulant and electrically interconnecting the pins with electrical contacts of the die, and no tie-bars coupling the die with the pins. Packages may also include die attach flags.

Publication date: 2022-03-17
Applicant: Semiconductor Components Industries, Llc
Inventors: Cervantes Frank Robert

How are Semiconductor Components Industries, Llc’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/643,207 Methods And Apparatus For Optical Image Stabilization OPAP Central, Docket
17/457,702 Rotor Position Sensing System For Permanent Magnet Synchronous Motors And Related Methods Docketed New Case – Ready for Examination OPAP Central, Docket
17/457,148 Semiconductor Package Structures And Methods Of Manufacture Docketed New Case – Ready for Examination OPAP Central, Docket
17/457,100 Integrated Circuit Direct Cooling Systems And Related Methods Docketed New Case – Ready for Examination OPAP Central, Docket
17/457,113 Semiconductor Wafer And Method Of Probe Testing Docketed New Case – Ready for Examination OPAP Central, Docket