Samsung Electro-Mechanics Co., Ltd Patent Portfolio Statistics

Samsung Electro-Mechanics Co., Ltd.

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Samsung Electro-Mechanics Co., Ltd. look like?

Total Applications: 10,474
Granted Patents: 5,736
Grant Index 57.99 %
Abandoned/Rejected Applications: 4,155 (42.01%)
In-Process Applications: 549
Average Grant Time: 2.46 Years
Average Office Actions: 1.39

Which Technology Area Samsung Electro-Mechanics Co., Ltd. is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
2848 Electrical Circuits and Systems 961
2837 Electrical Circuits and Systems 885
2847 Electrical Circuits and Systems 585
2834 Electrical Circuits and Systems 377
2872 Optics 371

How many patents are Samsung Electro-Mechanics Co., Ltd. filing every year?

Year Total Applications
2022 0*
2021 151*
2020 468
2019 505
2018 585

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Samsung Electro-Mechanics Co., Ltd. in USPTO?

Publication number:
Application number: 17/522,163

Abstract:
None

Publication date:
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventors: Hee Jung Jung


Publication number: US20220029274A1
Application number: 17/499,212

Abstract:
A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

Publication date: 2022-01-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventors: Chin Kim Mo


Publication number: US20220028612A1
Application number: 17/498,058

Abstract:
A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion respectively arranged on end portions of the internal electrodes exposed from first and second surfaces. The first and second side margin portions respectively include a first region adjacent to an outer side surface of each of the side margin portions, and a second region adjacent to the internal electrodes exposed from the first and second surfaces. The number of pores per unit area in the second region is less than the number of pores per unit area in the first region.

Publication date: 2022-01-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventors: Chul Shin Woo


How are Samsung Electro-Mechanics Co., Ltd.’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/522,163 Multilayer Ceramic Electronic Component To Be Embedded In Board, Manufacturing Method Thereof, And Printed Circuit Board Having Multilayer Ceramic Electronic Component Embedded Therein Docketed New Case – Ready for Examination 3992 Whittington, Kenneth
17/499,212 Chip Antenna OPAP Central, Docket
17/498,058 Multilayer Ceramic Capacitor And Method Of Manufacturing The Same OPAP Central, Docket
17/497,341 Image Capturing Lens System OPAP Central, Docket
17/493,569 Electronic Component And Board Having The Same Mounted Thereon OPAP Central, Docket