Raytheon Company Patent Portfolio Statistics

Raytheon Company

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Raytheon Company look like?

Total Applications: 7,417
Granted Patents: 6,187
Grant Index 90.12 %
Abandoned/Rejected Applications: 678 (9.88%)
In-Process Applications: 519
Average Grant Time: 2.87 Years
Average Office Actions: 1.53

Which Technology Area Raytheon Company is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
3662 Computerized Vehicle Controls and Navigation, Radio Wave, Optical and Acoustic Wave Communication, Robotics, and Nuclear Systems 377
3641 Aeronautics, Agriculture, Fishing, Trapping, Vermin Destroying, Plant and Animal Husbandry, Weaponry, Nuclear Systems, and License and Review 300
2872 Optics 203
3646 Aeronautics, Agriculture, Fishing, Trapping, Vermin Destroying, Plant and Animal Husbandry, Weaponry, Nuclear Systems, and License and Review 187
2821 185

How many patents are Raytheon Company filing every year?

Year Total Applications
2022 0*
2021 47*
2020 360
2019 410
2018 299

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Raytheon Company in USPTO?

Publication number: US20220003509A1
Application number: 17/481,741

Abstract:
A method of forming a thermal energy storage unit for a surface to be cooled or heated includes using an additive manufacturing process to form a plurality of non-rectilinear structures having a plurality of thermally conductive substructures, the substructures defining a plurality of interior cavities within the substructures and a plurality of exterior fluid channels that cross over or under the plurality of interior cavities, arranging the plurality of non-rectilinear structures in a plurality of housings, wherein each of the plurality of non-rectilinear structures is arranged in a corresponding one of the plurality of housings, and connecting the plurality of housings to each other to build up the thermal energy storage unit whereby the thermal energy storage unit is modular.

Publication date: 2022-01-06
Applicant: Raytheon Company
Inventors: Arthur J Michael


Publication number: US20210400820A1
Application number: 17/465,292

Abstract:
A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.

Publication date: 2021-12-23
Applicant: Raytheon Company
Inventors: Sikina Thomas V


Publication number: US20210368629A1
Application number: 17/395,977

Abstract:
An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

Publication date: 2021-11-25
Applicant: Raytheon Company
Inventors: Kevin Wilder


How are Raytheon Company’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/481,741 Additively Manufactured Thermal Energy Storage Units Docketed New Case – Ready for Examination OPAP Central, Docket
17/465,292 Preparation Of Solder Bump For Compatibility With Printed Electronics And Enhanced Via Reliability Docketed New Case – Ready for Examination OPAP Central, Docket
17/395,977 System And Method For Fabricating Z-Axis Vertical Launch Docketed New Case – Ready for Examination OPAP Central, Docket
17/385,407 Shape-Based Vehicle Classification Using Laser Scan And Neural Network OPAP Central, Docket
17/383,382 Radio Frequency Filtered Interface OPAP Central, Docket