Noria Corporation Patent Portfolio Statistics

Noria Corporation

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Noria Corporation look like?

Total Applications: 3
Granted Patents: 1
Grant Index 33.33 %
Abandoned/Rejected Applications: 2 (66.67%)
In-Process Applications: 0
Average Grant Time: 4.36 Years
Average Office Actions: 3.0

Which Technology Area Noria Corporation is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
2165 Data Bases & File Management 1
2833 Electrical Circuits and Systems 1
3689 Business Methods – Incentive Programs, Coupons; Electronic Shopping; Business Cryptography, Voting; Health Care; Point of Sale, Inventory, Accounting; Business Processing, Electronic Negotiation 1

How many patents are Noria Corporation filing every year?

Year Total Applications
2022 0*
2021 0*
2020 0
2019 0
2018 0

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Noria Corporation in USPTO?

Publication number: US20220028685A1
Application number: 17/498,437

Abstract:
Apparatuses and methods are described for removing edge bead on a wafer associated with a resist coating comprising a metal containing resist compositions. The methods can comprise applying a first bead edge rinse solution along a wafer edge following spin coating of the wafer with the metal based resist composition, wherein the edge bead solution comprises an organic solvent and an additive comprising a carboxylic acid, an inorganic fluorinated acid, a tetraalkylammonium compound, or a mixture thereof. Alternatively or additionally, the methods can comprise applying a protective composition to the wafer prior to performing an edge bead rinse. The protective composition can be a sacrificial material or an anti-adhesion material and can be applied only to the wafer edge or across the entire wafer in the case of the protective composition. Corresponding apparatuses for processing the wafers using these methods are presented.

Publication date: 2022-01-27
Applicant: Noria Corporation
Inventors: Benjamin Clark L


Publication number: US20210347791A1
Application number: 17/380,475

Abstract:
Organotin clusters are described with the formula R3Sn3(O2CR′)5−x(OH)2+x(μ3-O) with 0≤x<2; R=branched or cycloalkyl with 1 to 31 carbon atoms; R′═H or alkyl with 1 to 20 carbon atoms. Three carboxylato ligands are bridging, and two OH ligands are bridging. The remaining two carboxylato ligands are in non-bridging configurations, and the non-bridging carboxylato ligands are exchangeable in solution. Solutions of these clusters are suitable for forming radiation sensitive coatings that can be used to pattern nanometer scale structures. The radiation sensitive coatings are particularly suitable for EUV patterning.

Publication date: 2021-11-11
Applicant: Noria Corporation
Inventors: Meyers Stephen T


Publication number: US20210349390A1
Application number: 17/307,223

Abstract:
Multiple patterning approaches using radiation sensitive organometallic materials is described. In particular, multiple patterning approaches can be used to provide distinct multiple patterns of organometallic material on a hardmask or other substrate through a sequential approach that leads to a final pattern. The multiple patterning approach may proceed via sequential lithography steps with multiple organometallic layers and may involve a hardbake freezing after development of each pattern. Use of an organometallic resist with dual tone properties to perform pattern cutting and multiple patterning of a single organometallic layer are described. Corresponding structures are also described.

Publication date: 2021-11-11
Applicant: Noria Corporation
Inventors: Jason K Stowers


How are Noria Corporation’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/498,437 Apparatuses For Reducing Metal Residue In Edge Bead Region From Metal-Containing Resists OPAP Central, Docket
17/380,475 Organotin Clusters, Solutions Of Organotin Clusters, And Application To High Resolution Patterning Docketed New Case – Ready for Examination OPAP Central, Docket
17/307,223 Multiple Patterning With Organometallic Photopatternable Layers With Intermediate Freeze Steps Docketed New Case – Ready for Examination OPAP Central, Docket
17/198,669 Monoalkyl Tin Compounds With Low Polyalkyl Contamination, Their Compositions And Methods Docketed New Case – Ready for Examination OPAP Central, Docket
17/188,679 Process Environment For Inorganic Resist Patterning Docketed New Case – Ready for Examination OPAP Central, Docket