Kla-Tencor Corporation Patent Portfolio Statistics

Publication number: US20220099725A1
Application number: 17/548,255

Abstract:
An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.

Publication date: 2022-03-31
Applicant: Kla-Tencor Corporation
Inventors: Carl Truyens

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Publication number: US20220084179A1
Application number: 17/456,415

Abstract:
Disclosed are methods and apparatus for inspecting a photolithographic reticle. A plurality of reference far field images are simulated by inputting a plurality of reference near field images into a physics-based model, and the plurality of reference near field images are generated by a trained deep learning model from a test portion of the design database that was used to fabricate a test area of a test reticle. The test area of a test reticle, which was fabricated from the design database, is inspected for defects via a die-to-database process that includes comparing the plurality of reference far field reticle images simulated by the physic-based model to a plurality of test images acquired by the inspection system from the test area of the test reticle.

Publication date: 2022-03-17
Applicant: Kla-Tencor Corporation
Inventors: Fang Hawren

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Publication number: US20220012866A1
Application number: 17/486,213

Abstract:
Common events between layers on a semiconductor wafer are filtered. Common events should contain the majority of defects of interest. Only nuisance events that are common between layers on the semiconductor wafer remain, which reduces the nuisance rate. Defects that are common across layers can be filtered based on, for example, defect coordinates, a difference image, or defect attributes.

Publication date: 2022-01-13
Applicant: Kla-Tencor Corporation
Inventors: Bjorn Brauer

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