Hewlett-Packard Development Company, L.P Patent Portfolio Statistics

Hewlett-Packard Development Company, L.P.

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Hewlett-Packard Development Company, L.P. look like?

Total Applications: 45,615
Granted Patents: 34,499
Grant Index 80.98 %
Abandoned/Rejected Applications: 8,105 (19.02%)
In-Process Applications: 2,999
Average Grant Time: 3.33 Years
Average Office Actions: 1.93

Which Technology Area Hewlett-Packard Development Company, L.P. is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
2853 Printing/Measuring and Testing 3,000
2852 Printing/Measuring and Testing 1,676
2861 Printing/Measuring and Testing 1,059
2835 Electrical Circuits and Systems 1,025
Opap Parked GAU 977

How many patents are Hewlett-Packard Development Company, L.P. filing every year?

Year Total Applications
2022 0*
2021 1117*
2020 1,407
2019 1,417
2018 1,623

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Hewlett-Packard Development Company, L.P. in USPTO?

Publication number:
Application number: 17/602,187

Abstract:
None

Publication date:
Applicant: Hewlett-Packard Development Company, L.P.
Inventors: Heo Nam


Publication number: US20220024116A1
Application number: 17/492,384

Abstract:
According to an example, in a method for forming a three-dimensional (3D) printed object, a plurality of layers of the 3D printed object and a channel that extends through the plurality of layers may be formed, in which the plurality of layers is formed of a first material. In addition, a supporting element may be inserted into the channel such that the supporting element extends through multiple layers of the plurality of layers, in which the supporting element is formed of a second material that differs from the first material.

Publication date: 2022-01-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventors: Melanie Robertson


Publication number: US20220002149A1
Application number: 17/482,309

Abstract:
Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Publication date: 2022-01-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventors: Chen Chien-Hua


How are Hewlett-Packard Development Company, L.P.’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/602,187 Perform Security Jobs Using Authentication In Image Forming Apparatus
17/492,384 Three-Dimensional Printer With A Supporting Element Insertion Apparatus OPAP Central, Docket
17/482,309 Three-Dimensional Features Formed In Molded Panel Docketed New Case – Ready for Examination OPAP Central, Docket
17/478,558 Movable Mounting Assemblies Docketed New Case – Ready for Examination OPAP Central, Docket
17/477,089 Blanket Servicing Docketed New Case – Ready for Examination OPAP Central, Docket