Hewlett-Packard Development Company, L.P Patent Portfolio Statistics

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Hewlett-Packard Development Company, L.P.

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Hewlett-Packard Development Company, L.P. look like?

Assignee Art Units
Total Applications: 45,615 1,945,858
Granted Patents: 34,499 1,274,400
Grant Index 80.98% ↑ 80.51%
Abandoned/Rejected Applications: 8,105 (19.02%) 308,507 (19.49%)
In-Process Applications: 2,999 362,951
Average Grant Time: 3.33 Years ↑ 2.79 Years
Average Office Actions: 1.93 ↑ 1.54

Which Technology Area Hewlett-Packard Development Company, L.P. is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
2853 Printing/Measuring and Testing 3,000
2852 Printing/Measuring and Testing 1,676
2861 Printing/Measuring and Testing 1,059
2835 Electrical Circuits and Systems 1,025
Opap Parked GAU 977

How many patents are Hewlett-Packard Development Company, L.P. filing every year?

Year Total Applications Predicted
2022 0* 2081
2021 1117* 2028
2020 1,407 1873
2019 1,417 1417
2018 1,623 –
2017 1,696 –
2016 1,537 –
2015 1,166 –
2014 1,178 –
2013 1,409 –

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Hewlett-Packard Development Company, L.P. in USPTO?

Publication number: None
Application number: 17/637,652

Abstract:
–

Publication date: –
Applicant: Hewlett-Packard Development Company, L.P.
Inventors: Cheng Yow-Wei

Publication number: None
Application number: 17/626,766

Abstract:
–

Publication date: –
Applicant: Hewlett-Packard Development Company, L.P.
Inventors: Antonio Murciego Pablo Rodriguez

Publication number: US20220105726A1
Application number: 17/551,489

Abstract:
The present disclosure includes a description of an example printhead having multiple ejection dies. The ejection dies are coupled to a temperature sensor and send temperature signals to a controller. The printhead can also include a heater coupled to the ejection dies to apply heat to at least one ejection die.

Publication date: 2022-04-07
Applicant: Hewlett-Packard Development Company, L.P.
Inventors: H Mackenzie Mark

How are Hewlett-Packard Development Company, L.P.’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/637,652 Function Activations Via Display Device Depressions Sent to Classification contractor – –
17/626,766 Build Material Loading Sent to Classification contractor – –
17/551,489 Printheads Docketed New Case – Ready for Examination OPAP Central, Docket
17/550,941 Build Material Recycling System Of A Three-Dimensional (3D) Printer Docketed New Case – Ready for Examination OPAP Central, Docket
17/547,908 Build Material Dispensing Device Docketed New Case – Ready for Examination OPAP Central, Docket