Disco Corporation Patent Portfolio Statistics

Disco Corporation

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Disco Corporation look like?

Total Applications: 1,706
Granted Patents: 1,113
Grant Index 80.77 %
Abandoned/Rejected Applications: 265 (19.23%)
In-Process Applications: 306
Average Grant Time: 2.12 Years
Average Office Actions: 1.2

Which Technology Area Disco Corporation is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
3723 Manufacturing Devices & Processes, Machine Tools & Hand Tools 169
Opap Parked GAU 168
2812 Semiconductors/Memory 97
3742 Refrigeration, Vaporization, Ventilation, AndCombustion 94
3724 Manufacturing Devices & Processes, Machine Tools & Hand Tools 75

How many patents are Disco Corporation filing every year?

Year Total Applications
2022 0*
2021 140*
2020 196
2019 168
2018 190

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Disco Corporation in USPTO?

Publication number: US20220016731A1
Application number: 17/448,945

Abstract:
A laser processing method for processing a wafer using a laser processing apparatus, where the laser processing apparatus includes a holding unit, a laser oscillator for emitting a pulsed laser beam, a polygon mirror for dispersing the pulsed laser beam emitted from the laser oscillator, a condenser for condensing the pulsed laser beam dispersed by the polygon mirror and applying the condensed pulsed laser beam to the workpiece and dispersed region adjuster for controlling a dispersed region of the pulsed laser beam, where the laser processing method includes steps of holding the workpiece on the holding unit and processing the workpiece held by the holding unit by applying the pulsed laser beam, where during processing, the dispersed region adjuster controls the dispersed region of the pulsed laser beam by causing the pulsed laser beam to follow a direction in which the mirror facets of the polygon mirror are rotated.

Publication date: 2022-01-20
Applicant: Disco Corporation
Inventors: Keiji Nomaru


Publication number:
Application number: 17/433,223

Abstract:
None

Publication date:
Applicant: Disco Corporation
Inventors: Heinz Karl Priewasser


Publication number: US20220028742A1
Application number: 17/380,606

Abstract:
A method of processing a wafer includes a wafer preparing step of preparing a measurement wafer and a product wafer, a measurement etching step of supplying a gas in a plasma state to first areas of the measurement wafer that correspond to streets thereon to form grooves in the measurement wafer, a measuring step of demarcating a plurality of concentric areas in an array from a center to an outer circumference of the measurement wafer, and measuring depths of the grooves in the respective concentric areas, a thickness adjusting step of adjusting a thickness of the product wafer such that the product wafer is progressively thinner in areas thereof that correspond to the areas of the measurement wafer where the grooves are shallower, and an etching step of supplying a gas in a plasma state to second areas of the product wafer that correspond to streets thereon.

Publication date: 2022-01-27
Applicant: Disco Corporation
Inventors: Heinz Karl Priewasser


How are Disco Corporation’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/448,945 Laser Processing Method OPAP Central, Docket
17/433,223 Adhesive Sheet For Backgrinding And Production Method For Semiconductor Wafer
17/380,606 Method Of Processing Wafer OPAP Central, Docket
17/380,635 Laser Processing Apparatus OPAP Central, Docket
17/380,556 Protective Member Forming Apparatus OPAP Central, Docket