Disco Corporation Patent Portfolio Statistics
Profile Summary
This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.
How does the overall patent portfolio of Disco Corporation look like?
Total Applications: | 1,706 |
Granted Patents: | 1,113 |
Grant Index | 80.77 % |
Abandoned/Rejected Applications: | 265 (19.23%) |
In-Process Applications: | 306 |
Average Grant Time: | 2.12 Years |
Average Office Actions: | 1.2 |
Which Technology Area Disco Corporation is filing most patents in? (Last 10 years)
Art Unit | Definition | Total Applications |
3723 | Manufacturing Devices & Processes, Machine Tools & Hand Tools | 169 |
Opap | Parked GAU | 168 |
2812 | Semiconductors/Memory | 97 |
3742 | Refrigeration, Vaporization, Ventilation, AndCombustion | 94 |
3724 | Manufacturing Devices & Processes, Machine Tools & Hand Tools | 75 |
How many patents are Disco Corporation filing every year?
Year | Total Applications |
2022 | 0* |
2021 | 140* |
2020 | 196 |
2019 | 168 |
2018 | 190 |
*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published
Recently filed patent applications of Disco Corporation in USPTO?
Application number: 17/448,945
Abstract:
Publication date: 2022-01-20
Applicant: Disco Corporation
Inventors: Keiji Nomaru
Publication number: –
Application number: 17/433,223
Abstract:
None
Publication date: –
Applicant: Disco Corporation
Inventors: Heinz Karl Priewasser
Publication number: US20220028742A1
Application number: 17/380,606
Abstract:
Publication date: 2022-01-27
Applicant: Disco Corporation
Inventors: Heinz Karl Priewasser
How are Disco Corporation’s applications performing in USPTO?
Application Number | Title | Status | Art Unit | Examiner |
17/448,945 | Laser Processing Method | – | OPAP | Central, Docket |
17/433,223 | Adhesive Sheet For Backgrinding And Production Method For Semiconductor Wafer | – | – | – |
17/380,606 | Method Of Processing Wafer | – | OPAP | Central, Docket |
17/380,635 | Laser Processing Apparatus | – | OPAP | Central, Docket |
17/380,556 | Protective Member Forming Apparatus | – | OPAP | Central, Docket |