Disco Corporation Patent Portfolio Statistics

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Disco Corporation

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Disco Corporation look like?

Assignee Art Units
Total Applications: 1,706 2,180,937
Granted Patents: 1,113 1,386,490
Grant Index 80.77% ↑ 77.35%
Abandoned/Rejected Applications: 265 (19.23%) 405,903 (22.65%)
In-Process Applications: 306 388,544
Average Grant Time: 2.12 Years ↓ 2.54 Years
Average Office Actions: 1.2 ↓ 1.49

Which Technology Area Disco Corporation is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
3723 Manufacturing Devices & Processes, Machine Tools & Hand Tools 169
Opap Parked GAU 168
2812 Semiconductors/Memory 97
3742 Refrigeration, Vaporization, Ventilation, AndCombustion 94
3724 Manufacturing Devices & Processes, Machine Tools & Hand Tools 75

How many patents are Disco Corporation filing every year?

Year Total Applications Predicted
2022 0* 912
2021 140* 812
2020 196 602
2019 168 168
2018 190 –
2017 115 –
2016 110 –
2015 81 –
2014 71 –
2013 50 –

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Disco Corporation in USPTO?

Publication number: US20220181174A1
Application number: 17/457,706

Abstract:
A wafer manufacturing apparatus includes an ingot grinding unit for grinding an upper surface of an ingot to planarize the upper surface of the ingot, a laser applying unit for forming peel-off layers in the ingot at a depth therein, which corresponds to the thickness of a wafer to be produced from the ingot, from the upper surface of the ingot, a wafer peeling unit for holding the upper surface of the ingot and peeling off a wafer from the ingot at the peel-off layers, a tray having an ingot support portion and a wafer support portion, and a belt conveyor unit for delivering the ingot supported on the tray between the ingot grinding unit, the laser applying unit, and the wafer peeling unit.

Publication date: 2022-06-09
Applicant: Disco Corporation
Inventors: Ryohei Yamamoto

Publication number: US20220088742A1
Application number: 17/457,090

Abstract:
A grinding method for grinding a workpiece by use of a grinding apparatus including a holding table that holds the workpiece by a holding surface, and a grinding unit that grinds the workpiece held by the holding table by a grinding wheel having a plurality of grindstones arranged in an annular pattern includes a groove forming step of grinding the workpiece by bringing the grindstones into contact with the workpiece to form the workpiece with an arcuate groove having a depth of less than a finished thickness of the workpiece, and a grinding step of bringing the grindstones into contact with a surface side of the workpiece where the groove is formed to grind the workpiece until the thickness of the workpiece becomes the finished thickness.

Publication date: 2022-03-24
Applicant: Disco Corporation
Inventors: Keisuke Yamamoto

Publication number: US20220172952A1
Application number: 17/455,993

Abstract:
A processing method of a wafer includes trimming the wafer along its outer peripheral edge while causing a cutting blade to cut from a front surface into a chamfered portion to a depth greater than a finish thickness, so that an annular stepped portion is formed in an outer peripheral surplus region. A protective member is bonded to a side of the front surface of the wafer, and the wafer is ground from its back surface to thin the wafer to a finish thickness. Between trimming and grinding, a laser beam is applied to the stepped portion, so that annular modified layers which are to be fractured under a pressing force to be applied by the grinding are formed in the stepped portion, whereby the fractured fragments of the stepped portion are subdivided.

Publication date: 2022-06-02
Applicant: Disco Corporation
Inventors: Masaru Nakamura

How are Disco Corporation’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/457,706 Wafer Manufacturing Apparatus – OPAP Central, Docket
17/457,090 Grinding Method For Workpiece And Grinding Apparatus Docketed New Case – Ready for Examination OPAP Central, Docket
17/455,993 Processing Method Of Wafer – OPAP Central, Docket
17/455,492 Grinding Method Of Workpiece – OPAP Central, Docket
17/612,436 Nerve Detection Method And Device Docketed New Case – Ready for Examination OPAP Central, Docket