Asm Ip Holding B.V Patent Portfolio Statistics

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Asm Ip Holding B.V.

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Asm Ip Holding B.V. look like?

Assignee Art Units
Total Applications: 1,023 1,887,005
Granted Patents: 633 1,181,903
Grant Index 94.2% ↑ 78.45%
Abandoned/Rejected Applications: 39 (5.8%) 324,761 (21.55%)
In-Process Applications: 340 380,341
Average Grant Time: 2.58 Years ↑ 2.51 Years
Average Office Actions: 2.07 ↑ 1.48

Which Technology Area Asm Ip Holding B.V. is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
Opap Parked GAU 147
1716 Coating, Etching, Cleaning, Single Crystal Growth 117
1715 Coating, Etching, Cleaning, Single Crystal Growth 104
1718 Coating, Etching, Cleaning, Single Crystal Growth 54
1713 Coating, Etching, Cleaning, Single Crystal Growth 52

How many patents are Asm Ip Holding B.V. filing every year?

Year Total Applications Predicted
2022 0* 441
2021 154* 376
2020 177 380
2019 78 78
2018 118 –
2017 91 –
2016 77 –
2015 73 –
2014 58 –
2013 56 –

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Asm Ip Holding B.V. in USPTO?

Publication number: US20220102170A1
Application number: 17/550,022

Abstract:
Vertical batch furnace assembly for processing wafers comprising a cassette handling space, a wafer handling space, and a first wall separating the cassette handling space from the wafer handling space. The first wall has at least one wafer transfer opening in front of which a wafer transfer position for a wafer cassette is provided. The cassette handling space comprises a cassette storage, and a cassette handling mechanism. The cassette storage has a plurality of cassette storage positions and is configured to store a plurality of wafer cassettes. The cassette handling mechanism comprises a first cassette handler which is configured to transfer wafer cassettes between a first set of the cassette storage positions and the wafer transfer position. The cassette handling mechanism is provided with a second cassette handler which is configured to transfer wafer cassettes between a second set of the cassette storage positions and the wafer transfer position.

Publication date: 2022-03-31
Applicant: Asm Ip Holding B.V.
Inventors: Chris De Gm Ridder

Publication number: US20220189775A1
Application number: 17/546,186

Abstract:
Methods and systems for depositing rare earth metal carbide containing layers on a surface of a substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a cyclical deposition process such as an atomic layer deposition process for depositing a rare earth metal carbide containing layer onto a surface of the substrate.

Publication date: 2022-06-16
Applicant: Asm Ip Holding B.V.
Inventors: Qi Xie

Publication number: US20220102140A1
Application number: 17/545,047

Abstract:
A method for forming ultraviolet (UV) radiation responsive metal-oxide containing film is disclosed. The method may include, depositing an UV radiation responsive metal oxide-containing film over a substrate by, heating the substrate to a deposition temperature of less than 400° C., contacting the substrate with a first vapor phase reactant comprising a metal component, a hydrogen component, and a carbon component, and contacting the substrate with a second vapor phase reactant comprising an oxygen containing precursor, wherein regions of the UV radiation responsive metal oxide-containing film have a first etch rate after UV irradiation and regions of the UV radiation responsive metal oxide-containing film not irradiated with UV radiation have a second etch rate, wherein the second etch rate is different from the first etch rate.

Publication date: 2022-03-31
Applicant: Asm Ip Holding B.V.
Inventors: Hannu Huotari

How are Asm Ip Holding B.V.’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/550,022 Vertical Batch Furnace Assembly Docketed New Case – Ready for Examination OPAP Central, Docket
17/546,186 Method Of Forming Structures For Threshold Voltage Control – OPAP Central, Docket
17/545,047 Method For Forming An Ultraviolet Radiation Responsive Metal Oxide-Containing Film Docketed New Case – Ready for Examination OPAP Central, Docket
17/544,982 Method And Apparatus For Filling A Recess Formed Within A Substrate Surface Docketed New Case – Ready for Examination OPAP Central, Docket
17/544,167 Methods And Systems For Depositing A Layer – OPAP Central, Docket