Mediatek Inc Patent Portfolio Statistics

Publication number: US20220026552A1

Abstract:
A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

Publication date: 2022-01-27
Applicant: Mediatek Inc
Inventors: Chih-Ming Hung

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Publication number: US20220030234A1

Abstract:
According to a method for Adaptive Loop Filter (ALF) processing of reconstructed video, multiple indicators are signaled in slice at an encoder side or parsed at a decoder side, where the multiple indicators are Adaptive Parameter Set (APS) indices associated with temporal ALF filter sets for the ALF processing. A current indicator is determined from the multiple indicators, where the current indicator is used to select a current ALF filter set. Filtered-reconstructed pixels are derived for the current block by applying the current ALF filter to the current block. In another method, if the ALF processing applied at a target sample requires an outside sample on other side of a target virtual boundary from the target sample, the outside sample is replaced by a padded sample.

Publication date: 2022-01-27
Applicant: Mediatek Inc
Inventors: Chen Ching-Yeh

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Publication number: US20220020726A1

Abstract:
A semiconductor package structure includes a substrate having a substrate having a first surface and second surface opposite thereto, wherein the substrate comprises a wiring structure. The structure also has a first semiconductor die disposed on the first surface of the substrate and electrically coupled to the wiring structure, and a second semiconductor die disposed on the first surface and electrically coupled to the wiring structure, wherein the first semiconductor die and the second semiconductor die are arranged in a side-by-side manner. A molding material surrounds the first semiconductor die and the second semiconductor die, wherein the first semiconductor die is separated from the second semiconductor die by the molding material. Finally, an annular frame mounted on the first surface of the substrate, wherein the annular frame surrounds the first semiconductor die and the second semiconductor die.

Publication date: 2022-01-20
Applicant: Mediatek Inc
Inventors: Lin Tzu-Hung

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