Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd Patent Portfolio Statistics

Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd

Profile Summary

This article summarizes the perfomance of the assignee in the recent years. The overall statistics for this portfolio help to analyze the areas where the assignee is performing well. The filing trend, perfomance across the tech centers and the perfomance of the recent applications has been mentioned below. All the stats are calculated based on the perfomance in USPTO.

How does the overall patent portfolio of Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd look like?

Assignee Art Units
Total Applications: 22 269,195
Granted Patents: 20 193,440
Grant Index 90.91% 75.36%
Abandoned/Rejected Applications: 2 (9.09%) 63,242 (24.64%)
In-Process Applications: 0 12,513
Average Grant Time: 2.62 Years 2.51 Years
Average Office Actions: 1.15 1.47

Which Technology Area Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd is filing most patents in? (Last 10 years)

Art Unit Definition Total Applications
2835 Electrical Circuits and Systems 6
2841 3
3725 Manufacturing Devices & Processes, Machine Tools & Hand Tools 2
1794 1
2136 Memory Access and Control 1

How many patents are Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd filing every year?

Year Total Applications Predicted
2022 0* 381
2021 0* 354
2020 0 238
2019 0
2018 0
2017 0
2016 0
2015 0
2014 0
2013 0

*The drop in the number of applications filed in last two years compared to previous years is because applications can take up to 18 months to get published

Recently filed patent applications of Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd in USPTO?

Publication number: None
Application number: 17/429,775

Abstract:


Publication date:
Applicant: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd
Inventors: Tang Yong-Cheng


Publication number: US20220155805A1
Application number: 17/522,081

Abstract:
A method for adjusting furnace temperature of a reflow oven by AI, through obtaining product data of the reflow oven, obtaining initial characteristic data of a preceding work station and calculating mean values of temperatures of an upper furnace and a lower furnace, and taking the mean values as initial reflow characteristic data. Data as to first reflow characteristics of each reflow temperature zone and second reflow characteristics data of each zone are obtained, and data of the first and second reflow characteristics data are obtained. The electronic device further combines the characteristic data of the preceding work station with the combined reflow characteristics and combines results into a trained neural network model to output a temperature prediction, the oven temperature being adjusted according to the temperature prediction.

Publication date: 2022-05-19
Applicant: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd
Inventors: Li Ou-Yang


Publication number: US20220121834A1
Application number: 17/506,482

Abstract:
A receiving structure providing real-time information as to the materials constituting its contents includes a box body, a first side plate, and a second side plate. The box body, the first side plate, and the second side plate forming a receiving space, and the receiving space receives materials. A discharge port is formed between the second side plate and the first side plate, the discharge port is in communication with the receiving space, and the discharge port is configured to take out the material. A material checking unit is provided on the first side plate, the material checking unit detects and enables real time identification of the materials in the receiving structure.

Publication date: 2022-04-21
Applicant: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd
Inventors: Chen Er-Wei


How are Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd’s applications performing in USPTO?

Application Number Title Status Art Unit Examiner
17/429,775 Electronic Device And Video Wall Control Method Docketed New Case – Ready for Examination OPAP Central, Docket
17/522,081 Method For Adjusting Furnace Temperature Of A Reflow Oven, And Electronic Device Using The Same OPAP Central, Docket
17/506,482 Receiving Structure And Automatic Feeding System Docketed New Case – Ready for Examination OPAP Central, Docket