Hamamatsu Photonics K.K Patent Portfolio Statistics

Publication number: US20220102126A1
Application number: 17/549,113

Abstract:
A sample support body is a sample support body for ionizing a sample, including: a substrate having an irregular porous structure formed to communicate a first surface and a second surface opposite to each other; and a conductive layer provided at least on the first surface.

Publication date: 2022-03-31
Applicant: Hamamatsu Photonics K.K.
Inventors: Ikeda Takamasa

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Publication number: US20220238775A1
Application number: 17/615,159

Abstract:
In a method for making a light-emitting device, a plurality of windows (20) on which light source (10) are mounted is prepared, an block (AG1) in which a plurality of packages (30) are connected in an array is prepared, the window (20) is mounted in each package (30) of the block (AG1) to electrically connect a first pad (25) and a second pad (36) corresponding to each other, and the block (AG1) is separated to obtain the plurality of packages (30) on which the corresponding window (20) are mounted.

Publication date: –
Applicant: Hamamatsu Photonics K.K.
Inventors: Okuyama Yoshihiro

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Publication number: US20220084827A1
Application number: 17/534,835

Abstract:
A laminated element manufacturing method includes a first forming step of forming a first modified region along a line to cut by irradiating a semiconductor substrate of a first wafer with a laser light along the line to cut, a first grinding step of grinding the semiconductor substrate of the first wafer, a bonding step of bonding a circuit layer of a second wafer to the semiconductor substrate of the first wafer, a second forming step of forming a second modified region along the line to cut by irradiating a semiconductor substrate of the second wafer with a laser light along the line to cut, and a second grinding step of grinding the semiconductor substrate of the second wafer.

Publication date: 2022-03-17
Applicant: Hamamatsu Photonics K.K.
Inventors: Ryuji Sugiura

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