Siemens Aktiengesellschaft Patent Portfolio Statistics

Publication number: US20220198012A1
Application number: 17/637,389

Abstract:
Various embodiments include a method for security management at a scanning system installed outside a monitored system. The method comprises: acquiring first information for identification of a mobile storage device; generating third information to indicate current status of files on the mobile storage device; and sending the first information and the third information to a monitoring system to check if usage of the mobile storage device in the monitored system is secure.

Publication date: –
Applicant: Siemens Aktiengesellschaft
Inventors: Tang Wen

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Publication number: US20220150229A1
Application number: 17/439,520

Abstract:
Provided is a method for transmitting data packets over a network from a sender to a receiver via a communication link consisting of at least one transmission section, via which the data packet is transmitted from a sender node to a receiver node, the method having the following steps for at least one transmission section: first security information, which includes information about a cryptographic protective function used in the transmission of the data packet via an adjacent transmission section, is assigned to the data packet by the sender node, the data packet having the assigned security information is transmitted to the receiver node of the transmission section, the security information is checked in the receiver node against a preset guideline, and at least one measure is provided in accordance with the result of the check.

Publication date: 2022-05-12
Applicant: Siemens Aktiengesellschaft
Inventors: Fries Steffen

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Publication number: US20220208643A1
Application number: 17/617,844

Abstract:
An electronic circuit has three circuit carriers and two semiconductor components. A first semiconductor component contacts with its upper side an underside of a first circuit carrier, and with its underside an upper side of a second circuit carrier. The first circuit carrier has vias, with a first via connecting the first semiconductor component to a first conducting path and a second via connecting a connection element forming a second conducting path providing an integral connection between the circuit carriers. A second semiconductor component contacts the underside of the first circuit carrier and is electrically connected to the first or second conducting path. An underside of the second semiconductor component contacts an upper side of the third circuit carrier. A lateral thermal expansion coefficient of the first circuit carrier is greater than a lateral thermal expansion coefficient of both the second and the third circuit carrier.

Publication date: –
Applicant: Siemens Aktiengesellschaft
Inventors: Bigl Thomas

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